Moore’s law is driving an inevitable change in lithography technology.  Unlike earlier generations the road has several options; 193i 22nm, Extreme Ultraviolet Lithography (EUVL), Nano-Imprint Lithography (NIL).  New projection methods and new materials, zero process tolerance levels and an exponential increase in cost are driving the need for a lithography process that is near perfect. 

But, where does the lithography process begin?  Is it at the time of exposure or does a near perfect lithography process require experts to look beyond the traditional parameters of the exposure process?  At HamaTech, we believe that the definition of where the infrastructure “ends” and the lithography process “begins” has evolved and with the introduction of Next Generation Lithography the true beginning of the lithography process has been redefined.   Without the mask the lithography process cannot begin and without a pristine, defect-free mask at the point-of-exposure the probability of yield loss on Next Generation Lithography processes is a fact. 

For more than twenty years, HamaTech has exclusively focused on delivering mask integrity solutions to customers in the semiconductor and related industries.  Our established suite of photomask processing platforms cover critical phases of blank and patterned mask manufacturing:  post-exposure bake, develop, strip and clean.  MaskTrack Pro, HamaTech’s Next Generation Lithography platform, is specifically designed as an extension to the lithography process and brings a unique holistic mask management approach for the lifetime of the mask.