MaskTrack Pro offers a unique combination of physical and chemical cleaning technologies that enables customers to effectively remove organic and inorganic contamination without damage to the vulnerable features and material structures of the reticle.   The innovative design allows clustering of metrology systems and pod-in-pod stocking for a holistic mask management approach critical for EUVL processing.

Three Chamber HVM Advanced Lithography Configuration

• Segregated of strip, pre-clean and final clean processes
  
  • Unique in-situ UV surface preparation and cleaning
  • High frequency dual Megasonic cleaning up to 4MHz
  • Precision Nano Binary spray
  • Soft RTP purification and dehydration
  • Ultra-clean Hot and Cold DI water
  • Electrolyzed H2 and Ozonated DI water, Ultra-Dilute SC1
• Wet substrate transfer between pre and final clean chamber
• Dry flip functionality
• Low contact linear substrate transfer handling
• Multiple input/output and controlled environment substrate buffer stations
• 172nm UV surface preparation / backside cleaning
• Degassing DI-H20 input functionality (avoiding feature damage)
• 30nm prcess media filtration
• Interface to Pod-in-Pod automation module